Core Team – NanoZeta Technologies

We turn requirements into working silicon—on schedule and, often, on first silicon.

NanoZeta continuously invests in IP development to stay at the forefront of next-generation high-frequency wireless products.

Core Competencies

Nanozeta's Core Team

NanoZeta’s analog/RF team turns requirements into working silicon—on schedule and, most often, on first pass.

We combine 150+ years of collective experience with strong university collaborations to apply modern architectures where they help and proven circuits where reliability matters.

With dozens of successful RF/mmWave and mixed-signal tape-outs, we deliver production-ready designs, clear hand-offs, and lab-correlated results—tailored to your specs and constraints.

IC Technologies: TSMC nanometer processes, Global Foundries nanometer processes, ST Microelectronics deep submicron processes.
Down to 22nm for CMOS/FDSOI, down to 5nm for FinFET, down to 0.13um for BiCMOS.

Analog / RF / mmWave / Mixed-Signal ICs — spec → silicon
System architecture & modeling (requirements → budgets)
Circuit design (block-level & top-level)
Verification (corners, Monte Carlo, behavioral models)
Physical implementation & sign-off (RLCK/EM extraction, DRC/LVS/antenna, aging, ESD/pad-ring)
In-house mmWave design flow (microwave passives, EM structures, on-chip lines, correlation)
Sub-THz silicon IC design (device/EM co-optimization, D-/E-band exploration)

Digital design & verification (RTL, simulation, formal, STA)
Design for Test & Production (scan, BIST, ATE readiness)
IC–Package–PCB co-design flow (SI/PI, thermal, constraints hand-off)
Program & risk management (milestones, risk register, design reviews)
Technical documentation (specs, design reviews, sign-off reports, measurement documentation & sim↔lab correlation)